Apple iPhone 7/iPhone 7 Plus BGA Chip reballing Stencil for Soldering IC Chips.
Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight.
Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate.
The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation
Sunshine SS-034 Apple iPhone 7/iPhone 7 Plus BGA Chip Ball Template Stencil
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Availability: In stock 63 products
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Rückgabe innerhalb von 30 Tagen nach dem Kauf. Steuern werden nicht erstattet.
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